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INTEGRATED CIRCUITS
DATA SHEET
74HC/HCT258 Quad 2-input multiplexer; 3-state; inverting
Product specification File under Integrated Circuits, IC06 1999 Sep 02
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
FEATURES * Inverting data path * 3-state outputs interface directly with system bus * Output capability: bus driver * ICC category: MSI. GENERAL DESCRIPTION The 74HC/HCT258 are high-speed Si-gate CMOS devices and are pin compatible with Low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no. 7A. The 74HC/HCT258 have four identical 2-input multiplexers with 3-state outputs, which select 4 bits of data from two sources and are controlled by a common data select input (S). The data inputs from source 0 (1I0 to 4I0) are selected when input S is LOW and the data inputs from source 1 (1I1 to 4I1) are selected when S is HIGH. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf = 6 ns. 1Y = OE x ( 1I 1 x S + 1I 0 x S ) 2Y = OE x ( 2I 1 x S + 2I 0 x S ) 3Y = OE x ( 3I 1 x S + 3I 0 x S ) 4Y = OE x ( 4I 1 x S + 4I 0 x S )
74HC/HCT258
Data appears at the outputs (1Y to 4Y) in inverted form from the select inputs. The `258' is the logic implementation of a 4-pole, 2-position switch, where the position of the switch is determined by the logic levels applied to S. The outputs are forced to a high impedance OFF-state when OE is HIGH. The logic equations for the outputs are:
The `258' is identical to the `257' but has inverting outputs.
TYPICAL SYMBOL tPHL/tPLH PARAMETER propagation delay nI0, nI1 to nY S to nY CI CPD Notes 1. CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD x VCC2 x fi + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; (CL x VCC2 x fo) = sum of outputs; CL = output load capacitance in pF; VCC = supply voltage in Volts. 2. For HC the condition is VI = GND to VCC; For HCT the condition is VI = GND to VCC - 1.5 V. input capacitance power dissipation capacitance per multiplexer notes 1 and 2 CONDITIONS HC CL = 15 pF; VCC = 5 V 9 14 3.5 55 13 16 3.5 38 HCT ns ns pF pF UNIT
1999 Sep 02
2
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME 74HC258N; 74HCT258N 74HC258D; 74HCT258D 74HC258DB PIN DESCRIPTION PIN NO. 1 2, 5, 11 and 14 3, 6, 10 and 13 4, 7, 9 and 12 8 15 16 SYMBOL S 1I0 to 4I0 1I1 to 4I1 1Y to 4Y GND OE VCC common data select input data inputs from source 0 data inputs from source 1 3-state multiplexer outputs ground (0 V) 3-state output enable input (active LOW) positive supply voltage NAME AND FUNCTION DIP16 SO16 SSOP16 DESCRIPTION plastic dual in-line package; 16 leads (300 mil); long body
74HC/HCT258
VERSION SOT38-1 SOT109-1 SOT338-1
plastic small outline package; 16 leads; body width 3.9 mm plastic shrink small outline package; 16 leads; body width 5.3 mm
fpage fpage fpage
1 15
1 2 3 1I0 1I1 2I0 2I1 3I0 3I1 4I0 4I1 OE
MGA832
G1 EN
S 1I0 1I1 1Y 2I0 2I1 2Y GND
1 2 3 4
16 VCC 15 OE 14 3I0
S 1Y 4
2 2Y 7 3 5 3Y 9 6 11 4Y 12 10 14 13
5 6 14 13 11
1 1
MUX 4
258
5 6 7 8
MGA830
13 3I1 12 4Y 11 4I0 10 4I1 9 3Y
7
9
10 15
12
MGA831
Fig.1 Pin configuration.
Fig.2 Logic symbol.
Fig.3 IEC logic symbol.
1999 Sep 02
3
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
74HC/HCT258
handbook, full pagewidth
2 1I0
3 1I1
5 2I0
6 2I1
14 3I0
13 3I1
11 4I0
10 4I1
1
S
SELECTOR
15
OE 3-STATE MULTIPLEXER OUTPUTS 1Y 4 2Y 7 3Y 12 4Y 9
MBL095
Fig.4 Functional diagram.
FUNCTION TABLE See note 1 INPUTS OE H L L L L Note 1. H = HIGH voltage level; L = LOW voltage level; X = don't care; Z = high impedance OFF-state.
3I0 3Y 3I1
OUTPUT nI1 X L H X X Z H L H L nY
1I0 1Y 1I1
S X H H L L X X X L H
nI0
2I0 2Y 2I1
4I0 4Y 4I1
OE
S
MBL096
Fig.5 Logic diagram.
1999 Sep 02
4
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
DC CHARACTERISTICS FOR 74HC
74HC/HCT258
For the DC characteristics see chapter "HCMOS family characteristics", section "Family specifications". Output capability: bus driver. ICC category: MSI. AC CHARACTERISTICS FOR 74HC GND = 0 V; tr = tf = 6 ns; CL = 50 pF. Tamb (C) SYMBOL PARAMETER MIN. tPHL/tPLH propagation delay; nI0 to nY; nI1 to nY propagation delay; S to nY - - - - - - tPZH/tPZL 3-state output enable time OE to nY 3-state output disable time OE to nY output transition time - - - - - - - - - 25 TYP. 30 11 9 47 17 14 39 14 11 55 20 16 14 5 4 MAX. 95 19 16 140 28 24 140 28 24 150 30 26 60 12 10 - - - - - - - - - - - - - - - -40 to +85 MIN. MAX. 120 24 20 175 35 30 175 35 30 190 38 33 75 15 13 -40 to +125 MIN. - - - - - - - - - - - - - - - TEST CONDITIONS UNIT V CC WAVEFORMS (V) MAX. ns 2.0 4.5 6.0 ns 2.0 4.5 6.0 ns 2.0 4.5 6.0 ns 2.0 4.5 6.0 ns 2.0 4.5 6.0 see Fig.6 see Fig.7 see Fig.7 see Fig.6 see Fig.6
145 29 25 210 42 36 210 42 36 225 45 38 90 18 15
tPHZ/tPLZ
tTHL/tTLH
1999 Sep 02
5
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
DC CHARACTERISTICS FOR 74HCT
74HC/HCT258
For the DC characteristics see chapter "HCMOS family characteristics", section "Family specifications". Output capability: bus driver. ICC category: MSI. Note to HCT types The value of additional quiescent supply current (ICC) for a unit load of 1 is given in the family specifications. To determine ICC per input, multiply this value by the unit load coefficient shown in Table 1. Table 1 INPUT nI0 nI1 OE S UNIT LOAD COEFFICIENT 0.50 0.50 1.50 1.50
AC CHARACTERISTICS FOR 74HCT GND = 0 V; tr = tf = 6 ns; CL = 50 pF. Tamb (C) SYMBOL PARAMETER MIN. tPHL/tPLH propagation delay; nI0 to nY; nI1 to nY propagation delay; S to nY tPZH/tPZL tPHZ/tPLZ tTHL/tTLH 3-state output enable time; OE to nY 3-state output disable time; OE to nY output transition time - - - - - 25 -40 to +85 - - - - - -40 to +125 UNIT - - - - - TEST CONDITIONS VCC (V) 4.5 4.5 4.5 4.5 4.5 WAVEFORMS see Fig.6 see Fig.6 see Fig.7 see Fig.7 see Fig.6
TYP. MAX. MIN. MAX. MIN. MAX. 16 19 18 17 5 27 34 30 30 12 34 43 38 38 15 41 51 45 45 18 ns ns ns ns ns
1999 Sep 02
6
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
AC WAVEFORMS
74HC/HCT258
handbook, full pagewidth
S, nl0, nl1 INPUT
VM(1)
tPHL
tPLH
nY OUTPUT
VM(1)
MBL097
tTHL
tTLH
(1) HC: VM = 50%; VI = GND to VCC. HCT: VM = 1.3 V; VI = GND to 3 V.
Fig.6
Waveforms showing input (nI0, nI1 and S) to output (nY) propagation delays and output transition times.
handbook, full pagewidth
tr
tf
OE INPUT
VM(1)
tPLZ OUTPUT LOW-to-OFF OFF-to-LOW tPHZ OUTPUT HIGH-to-OFF OFF-to-HIGH outputs enabled 90%
tPZL
VM(1) 10% tPZH
VM(1) outputs enabled
MBL098
outputs disabled
(1) HC: VM = 50%; VI = GND to VCC. HCT: VM = 1.3 V; VI = GND to 3 V.
Fig.7 Waveforms showing the 3-state enable and disable times.
1999 Sep 02
7
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body
74HC/HCT258
SOT38-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 MH wM (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-10-02 95-01-19
1999 Sep 02
8
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
74HC/HCT258
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp 1 e bp 8 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.010 0.057 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.041 0.228
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-23 97-05-22
1999 Sep 02
9
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
74HC/HCT258
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
D
E
A X
c y HE vM A
Z 16 9
Q A2 pin 1 index Lp L 1 bp 8 wM detail X A1 (A 3) A
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.0 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 6.4 6.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 1.00 0.55 8 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT338-1 REFERENCES IEC JEDEC MO-150AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 94-01-14 95-02-04
1999 Sep 02
10
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. Surface mount packages REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
74HC/HCT258
Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 11
1999 Sep 02
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
Suitability of IC packages for wave, reflow and dipping soldering methods
74HC/HCT258
SOLDERING METHOD MOUNTING PACKAGE WAVE Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount BGA, SQFP HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1999 Sep 02 12 This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. suitable(2) not suitable not suitable(3) suitable not recommended(4)(5) not recommended(6) REFLOW(1) DIPPING - suitable suitable suitable suitable suitable suitable - - - - -
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
NOTES
74HC/HCT258
1999 Sep 02
13
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
NOTES
74HC/HCT258
1999 Sep 02
14
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
NOTES
74HC/HCT258
1999 Sep 02
15
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 67
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
245002/02/pp16
Date of release: 1999
Sep 02
Document order number:
9397 750 06308

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